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Thermal Interface Materials
Stanford Reference:
03-235
Abstract
This invention provides a technique using nano-structured materials to improve the heat transfer capability of traditional composite thermal interface materials. An embodiment of the present invention indicates that the enhancement in thermal conductivity can be more than 100%.
Applications
Promote heat flow from a heat-generating device to its cooling components
Release thermal expansion mismatch
Advantages
Higher thermal conductivity
Lower interface thermal resistance
Compatible usage with traditional thermal interface materials
Publications
Hu, X., Jiang, L., and Goodson, K.E., "Thermal Conductance Enhancement of Particle-Filled Thermal Interface Materials using Carbon Nanotube Inclusions", Thermal and Thermomechanical Phenomena in Electronic Systems, 1-4 June 2004, pages 63 - 69 Vol.1.
Web Site
Goodson Lab
Innovators & Portfolio
Kenneth Goodson
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Xuejiao (Jack) Hu
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Linan Jiang
Patent Status
Published Application: 20050171269
Issued : 7,504,453 (USA)
Date Released
2/2/2004 12:00
Licensing Contact
Luis Mejia, Senior Licensing Manager, Physical Sciences
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Related Keywords
materials
thermal interface materials
PS: Materials: Electronics Packaging
PS: materials: carbon nanotubes
PS: semiconductor: microcomponents
PS: semiconductor
