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High Q Inductor
Stanford Reference:
04-112
Abstract
This invention is an efficient and very small high frequency inductor developed by Stanford researchers and made on an active substrate, such as silicon. It is designed to be integrated into a chip and was specifically created for DC to DC voltage step down converters (known as ‘buck converters’). The inductor includes a magnetic core made of a single layer of magnetic material, and its design is very effective in terms of the area it occupies and its low electrical resistance. Because of the active substrate the inductor is built on, it achieves a much higher quality factor than current inductors, which means that it works significantly better at high frequencies and suffers lower losses from electrical resistance. This inductor is ideal for providing output voltages to integrated chips, particularly VLSI (very large scale integration) chips, and it reduces power consumption and significantly reduces system size and cost.
In demonstration devices inductances of greater than 70 nano-Henries with electrical resistance of less than 1 ohm has been shown for devices under 1 square millimeter in size. The inductances achieved are more than 30 times what has been achieved with similar air core inductors and the quality factors are 5 times higher than similar air core inductors. Inductance densities of over 200 nano-Henries per square millimeter have been achieved, and the results have followed analytical models quite well.
Applications
Integrated electronics chips and packages
Applications requiring simple, small, efficient inductors (particularly in integrated circuis)
System on chip and system in package designs, where integrated inductors are key
Higher performance and lower power consumption chips
Advantages
Greatly reduced system and component sized (compared to standard passive components)
Decreased power consumption (both because of reduced component resistance and elimination of interconnects required for standard soldered-on inductors)
Lower production costs
High inductance, low electrical resistance and high quality factors compared to standard passive components
Low ohmic losses due to low resistance
Reduced interference with surrounding components
Publications
US Published Patent Application 20090201113,
"Integrated Inductor Structure and Method of Fabrication"
D. W. Lee, K.-P. Hwang and S. X. Wang,
"Fabrication and Analysis of High-Performance Integrated Solenoid Inductor With Magnetic Core,"
IEEE Trans. Mag.
, 44, 4089-95, 2008.
D. W. Lee, L. Li, S. X. Wang, Jiongxin Lu, C. P. Wong, Swapan K. Bhattacharya, and John Papapolymerou, Embedded Passives, book chapter in Materials for Advanced Packaging, Daniel Lu, CP Wong, Eds., Springer, 2008.
Innovators & Portfolio
Henning Braunisch
Ankur Mohan Crawford
Raj Nair
Gilroy Vandentop
Shan Wang
more technologies from Shan Wang »
Patent Status
Published Application: 20090201113
Published Application: 20070069333
Issued : 9,153,547 (USA)
Date Released
10/5/2017 12:00
Licensing Contact
Chris Tagge, Technology Licensing Program Manager
(650) 725-8402
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Related Keywords
inductor
VLSI
magnetic
PS: semiconductor: microcomponents
electronic component
SoC
system-on-chip
electronic system
PS: electronics: integrated circuit
integrated systems
PS: materials: electronics packaging
micro electronics
microelectronics
analog circuits
PS: consumer products: electronics
digital circuits
PS: electronics
PS: semiconductor
materials
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