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A Method for Heteroepitaxial Growth of Germanium on Silicon


Stanford Reference:

04-132


Abstract


Stanford researchers have patented a growth and anneal process for growing heteroepitaxial-germanium directly onto silicon. Low surface roughness and defects are confined near the Si/Ge interface, thus not threading to the surface as expected in this lattice mismatched system. This process creates defect-free, fully-relaxed, smooth, single crystal germanium layers on silicon without a graded buffer layer or any chemical-mechanical planarization. This technology simplifies heterogeneous integration of germanium CMOS and optoelectronic devices on silicon.

Applications


  • Ge MOSFETs with advanced high-K gate dielectric and metal gate integrated on Si Ge Photodetectors, Metal-Semiconductor-Metal (MSM) and p-i-n for optical interconnects
  • Ge based lasers integrated on Si
  • Bonding for Germanium on Insulator (GOI) fabrication and 3D applications
  • GaAs growth on CVD Ge for the eventual integration of Ge
  • Si and GaAs Ge/Si quantum well devices for DRAM, photonic and spintronic applications
  • Ge thin film photovoltaic devices
  • III-V on Si Tandem photovoltaic devices

Advantages


  • Simple, in-situ hydrogen anneal
  • No Chemical Mechanical Polishing (CMP) necessary
  • No thick SiGe Graded layer necessary
  • High purity epi-Ge achieved as compared to bulk germanium

Publications



Innovators & Portfolio



Patent Status



Date Released

 9/14/2018 12:00
 

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Related Keywords


photodetector   SiGe   PS: semiconductor: CMOS (complementary metal oxide)   GeOI (Germanium-on-insulator)   PS: chemicals: germanium   spintronics   PS: semiconductor: manufacturing   PS: communications: optical   PS: communications: wireless   PS: electronics: optoelectronic   PS: photonics: silicon   MOSFET   04-132   PS: semiconductor: processing   DRAM   PS: thin film